Electroless copper plating using dimethylamine borane as reductantCitation formats

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Electroless copper plating using dimethylamine borane as reductant. / Liao, Yong; Zhang, Shengtao; Dryfe, Robert.

In: Particuology, Vol. 10, No. 4, 08.2012, p. 487-491.

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Liao, Yong ; Zhang, Shengtao ; Dryfe, Robert. / Electroless copper plating using dimethylamine borane as reductant. In: Particuology. 2012 ; Vol. 10, No. 4. pp. 487-491.

Bibtex

@article{567a3d5798664481a3a324bee506396c,
title = "Electroless copper plating using dimethylamine borane as reductant",
abstract = "Electroless copper plating was studied using dimethylamine borane (DMAB) as reductant and 1,5,8,12-tetraazadodecane as additive and triethanolamine (TEA) as buffer. The effects of pH, temperature and concentrations of reactants and additives on the anodic oxidation of DMAB and the cathodic reduction of copper ion were investigated. Experimental results indicate that high pH values (10-12.5) promote the oxidation of DMAB, and suppress the reduction of the copper ion, while high bath temperatures (55-70 °C) accelerate both anodic oxidation and cathodic reduction. Increase of the Cu 2+ and DMAB concentrations can improve the deposition rate of copper plating. Results for a dual-chelating-agent system indicate that 1,5,8,12-tetraazadodecane plays an important role in chelation, while the main effect of TEA is adsorption on copper surfaces to inhibit DMAB oxidation and to promote deposition. {\circledC} 2012 Published by Elsevier B.V. on behalf of Chinese Society of Particuology and Institute of Process Engineering, Chinese Academy of Sciences.",
keywords = "Anodic oxidation, Cathodic reduction, DMAB, Electroless copper plating, Polarization",
author = "Yong Liao and Shengtao Zhang and Robert Dryfe",
year = "2012",
month = "8",
doi = "10.1016/j.partic.2011.09.009",
language = "English",
volume = "10",
pages = "487--491",
journal = "Particuology",
issn = "1674-2001",
publisher = "Elsevier BV",
number = "4",

}

RIS

TY - JOUR

T1 - Electroless copper plating using dimethylamine borane as reductant

AU - Liao, Yong

AU - Zhang, Shengtao

AU - Dryfe, Robert

PY - 2012/8

Y1 - 2012/8

N2 - Electroless copper plating was studied using dimethylamine borane (DMAB) as reductant and 1,5,8,12-tetraazadodecane as additive and triethanolamine (TEA) as buffer. The effects of pH, temperature and concentrations of reactants and additives on the anodic oxidation of DMAB and the cathodic reduction of copper ion were investigated. Experimental results indicate that high pH values (10-12.5) promote the oxidation of DMAB, and suppress the reduction of the copper ion, while high bath temperatures (55-70 °C) accelerate both anodic oxidation and cathodic reduction. Increase of the Cu 2+ and DMAB concentrations can improve the deposition rate of copper plating. Results for a dual-chelating-agent system indicate that 1,5,8,12-tetraazadodecane plays an important role in chelation, while the main effect of TEA is adsorption on copper surfaces to inhibit DMAB oxidation and to promote deposition. © 2012 Published by Elsevier B.V. on behalf of Chinese Society of Particuology and Institute of Process Engineering, Chinese Academy of Sciences.

AB - Electroless copper plating was studied using dimethylamine borane (DMAB) as reductant and 1,5,8,12-tetraazadodecane as additive and triethanolamine (TEA) as buffer. The effects of pH, temperature and concentrations of reactants and additives on the anodic oxidation of DMAB and the cathodic reduction of copper ion were investigated. Experimental results indicate that high pH values (10-12.5) promote the oxidation of DMAB, and suppress the reduction of the copper ion, while high bath temperatures (55-70 °C) accelerate both anodic oxidation and cathodic reduction. Increase of the Cu 2+ and DMAB concentrations can improve the deposition rate of copper plating. Results for a dual-chelating-agent system indicate that 1,5,8,12-tetraazadodecane plays an important role in chelation, while the main effect of TEA is adsorption on copper surfaces to inhibit DMAB oxidation and to promote deposition. © 2012 Published by Elsevier B.V. on behalf of Chinese Society of Particuology and Institute of Process Engineering, Chinese Academy of Sciences.

KW - Anodic oxidation

KW - Cathodic reduction

KW - DMAB

KW - Electroless copper plating

KW - Polarization

U2 - 10.1016/j.partic.2011.09.009

DO - 10.1016/j.partic.2011.09.009

M3 - Article

VL - 10

SP - 487

EP - 491

JO - Particuology

JF - Particuology

SN - 1674-2001

IS - 4

ER -