Efficient Modeling of Crosstalk Noise On Power Distribution Networks for Contactless 3-D ICsCitation formats

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Efficient Modeling of Crosstalk Noise On Power Distribution Networks for Contactless 3-D ICs. / Papistas, Ioannis; Pavlidis, Vasileios.

In: IEEE Transactions on Circuits and Systems I: Regular Papers, 23.01.2018.

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Papistas, Ioannis ; Pavlidis, Vasileios. / Efficient Modeling of Crosstalk Noise On Power Distribution Networks for Contactless 3-D ICs. In: IEEE Transactions on Circuits and Systems I: Regular Papers. 2018.

Bibtex

@article{5e7b5b94469343c589b74fbc68caa60b,
title = "Efficient Modeling of Crosstalk Noise On Power Distribution Networks for Contactless 3-D ICs",
abstract = "An efficient and frequency-dependent modeldescribing the crosstalk noise on power distribution networksdue to inductive links in contactless 3-D ICs is presented. A twostepapproach is followed to model the crosstalk effect. During thefirst step, the mutual inductance between the power distributionnetwork and the inductive link is analytically determined. Dueto the weak dependence of mutual inductance to frequency,a magnetostatic model is proposed for this step. The modelincludes the physical and electrical characteristics of both theon-chip inductor and the wires of the power distribution network.In this way, different power network topologies can be modeledfacilitating noise analysis in the vicinity of the on-chip inductor.This approach is justified by the typical use of regular powernetwork topologies in modern integrated circuits. In the secondstage, the noise is assessed with SPICE simulations, consideringthe mutual inductance between the two structures from thefirst step and the resistance variations due to high frequencyeffects. Thus, an efficient, scalable, and accurate method forthe analysis of the crosstalk effects due to inductive links isprovided, without resorting on computationally expensive andtime consuming full-wave simulations. Compared with the fullwavesimulations, the induced noise is evaluated four orders ofmagnitude faster with the proposed model. The accuracy of theproposed model is within 10% of the respective noise computedwith a commercial electromagnetics simulator using the finiteelement method. An analysis including the effect of substrateresistivity on the crosstalk noise is also presented.",
author = "Ioannis Papistas and Vasileios Pavlidis",
year = "2018",
month = jan,
day = "23",
doi = "10.1109/TCSI.2018.2791498",
language = "English",
journal = "IEEE Transactions on Circuits and Systems I: Regular Papers",
issn = "1549-8328",
publisher = "IEEE",

}

RIS

TY - JOUR

T1 - Efficient Modeling of Crosstalk Noise On Power Distribution Networks for Contactless 3-D ICs

AU - Papistas, Ioannis

AU - Pavlidis, Vasileios

PY - 2018/1/23

Y1 - 2018/1/23

N2 - An efficient and frequency-dependent modeldescribing the crosstalk noise on power distribution networksdue to inductive links in contactless 3-D ICs is presented. A twostepapproach is followed to model the crosstalk effect. During thefirst step, the mutual inductance between the power distributionnetwork and the inductive link is analytically determined. Dueto the weak dependence of mutual inductance to frequency,a magnetostatic model is proposed for this step. The modelincludes the physical and electrical characteristics of both theon-chip inductor and the wires of the power distribution network.In this way, different power network topologies can be modeledfacilitating noise analysis in the vicinity of the on-chip inductor.This approach is justified by the typical use of regular powernetwork topologies in modern integrated circuits. In the secondstage, the noise is assessed with SPICE simulations, consideringthe mutual inductance between the two structures from thefirst step and the resistance variations due to high frequencyeffects. Thus, an efficient, scalable, and accurate method forthe analysis of the crosstalk effects due to inductive links isprovided, without resorting on computationally expensive andtime consuming full-wave simulations. Compared with the fullwavesimulations, the induced noise is evaluated four orders ofmagnitude faster with the proposed model. The accuracy of theproposed model is within 10% of the respective noise computedwith a commercial electromagnetics simulator using the finiteelement method. An analysis including the effect of substrateresistivity on the crosstalk noise is also presented.

AB - An efficient and frequency-dependent modeldescribing the crosstalk noise on power distribution networksdue to inductive links in contactless 3-D ICs is presented. A twostepapproach is followed to model the crosstalk effect. During thefirst step, the mutual inductance between the power distributionnetwork and the inductive link is analytically determined. Dueto the weak dependence of mutual inductance to frequency,a magnetostatic model is proposed for this step. The modelincludes the physical and electrical characteristics of both theon-chip inductor and the wires of the power distribution network.In this way, different power network topologies can be modeledfacilitating noise analysis in the vicinity of the on-chip inductor.This approach is justified by the typical use of regular powernetwork topologies in modern integrated circuits. In the secondstage, the noise is assessed with SPICE simulations, consideringthe mutual inductance between the two structures from thefirst step and the resistance variations due to high frequencyeffects. Thus, an efficient, scalable, and accurate method forthe analysis of the crosstalk effects due to inductive links isprovided, without resorting on computationally expensive andtime consuming full-wave simulations. Compared with the fullwavesimulations, the induced noise is evaluated four orders ofmagnitude faster with the proposed model. The accuracy of theproposed model is within 10% of the respective noise computedwith a commercial electromagnetics simulator using the finiteelement method. An analysis including the effect of substrateresistivity on the crosstalk noise is also presented.

U2 - 10.1109/TCSI.2018.2791498

DO - 10.1109/TCSI.2018.2791498

M3 - Article

JO - IEEE Transactions on Circuits and Systems I: Regular Papers

JF - IEEE Transactions on Circuits and Systems I: Regular Papers

SN - 1549-8328

ER -