Contactless Inter-Tier Communication for Heterogeneous 3-D ICs

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A heterogeneous contactless transceiver circuit is
designed to provide half duplex communication for a 3-D system
considering specific bonding constraints. The system is composed
of two tiers and is integrated face-to-back to support fluidic
sensing. Communication between the tiers is achieved through
inductive links. Each tier is considered to be fabricated in a different
technology node to enable low manufacturing cost and benefit
from the advantages each technology offers. Both the uplink
and downlink transceivers achieve data rates that reach 1 Gbps
with non-return-to-zero data encoding. Energy efficiency is the
predominant objective, with the uplink dissipating 4:93 mW and
the downlink 10:53 mW. A 5:2x power reduction is achieved
when using heterogeneous technologies, compared to a state-of-
the-art 0:35 μm transceiver, while the dissipated energy is
decreased by 34% as compared to a state-of-the-art 65 nm
transceiver.

Bibliographical metadata

Original languageEnglish
Title of host publicationInternational Symposium on Circuits and Systems
Number of pages4
StateAccepted/In press - 20 Feb 2017
EventIEEE International Symposium on Circuits and Systems - Baltimore, United States

Conference

ConferenceIEEE International Symposium on Circuits and Systems
Abbreviated titleISCAS 2017
CountryUnited States
CityBaltimore
Period28/05/1731/05/17
Internet address