A novel thermally evaporated etching mask for low-damage dry etching

Research output: Contribution to journalArticle

  • External authors:
  • Yiming Wang
  • Gengchang Zhu
  • Qingpu Wang
  • Qian Xin
  • Lin Han

Abstract

Dry etching is widely used for nanofabrication and it requires reliable etching masks. However, hard dry etching masks usually need high-temperature and/or plasma deposition, which may causes damage to temperature-sensitive materials and semiconductor surface. Here, we develop a novel etching mask material, silicon monoxide (SiO), which is thermally evaporated and hence can avoid such drawbacks. The etching selectivity of evaporated SiO is shown to be higher than 50:1, comparable to sputtered SiO2. A nanochannel device, called self-switching diode (SSD), is fabricated to evaluate the mask-deposition-process damage because of its high sensitivity to the process damage. In comparison to commonly used sputtered SiO2 and polymethyl methacrylate (PMMA) mask, the SSD fabricated using evaporated SiO exhibit the highest channel conductance, strongest nonlinearity, and best high-frequency performance. Hall measurements also reveal that the carrier mobility of nanochannels etched with SiO mask is twice that of similar channels with SiO2 mask.

Bibliographical metadata

Original languageEnglish
Pages (from-to)290
JournalIEEE Transactions on Nanotechnology
Volume16
Issue number2
DOIs
StatePublished - 1 Feb 2017